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Embedded Computing
ET977
AMD Ryzen™ Embedded V1000/ R1000 Series COM Express Type-6 (R3.0) CPU Module
- Onboard AMD Ryzen™ Embedded V1000/ R1000 Series
- 2x DDR4-2400 SO-DIMM sockets, Max. 32GB, ECC compatible
- Supports 4x independent displays (HDMI/DVI/DisplayPort, LVDS, and eDP) via the carrier board
- 4x USB 3.1, 8x USB 2.0, 2x SATA III
- Supports TPM (2.0)
The ET977 is a low-power COM Express Basic Type 6 modules based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields. It allows users to deliver basic embedded solutions with a new class of performance and power efficiency. Built with the AMD Ryzen™ Embedded V1000/R1000 SoC, the board is very suitable for modular designs and platforms that require high scalability to meet customers' time-to-market needs.
The new ET977 provides powerful computing with 'Zen' CPU cores and excellent image processing performance with the integrated AMD Radeon Vega graphics with 3 compute units to deliver stunningly visual experiences. It features four (V1000) or three (R1000) independent displays (HDMI/DVI/DP, LVDS or eDP) with up to 4K UltraHD resolutions and two DDR4 SO-DIMM slots for up to 32GB memory and with ECC compatibility.
The unit provides a wealth of advanced connectivity options including 2x serial, 4x USB 3.1, 8x USB 2.0, and 2x SATA 6Gb/s ports, as well as high-speed PCIe 3.0 lanes. Measuring 125mm x 95 mm, the Computer-on-Module is available in V1807B and V1605B variants for high computing and R1606G variant for low-power applications. Both Windows 10 and Linux Ubuntu are supported.
| CPU | Onboard AMD Ryzen™ Embedded V1000 / R1000 Series |
| PCH | N/A |
| Memory | 2x DDR4 SO-DIMM, Max. 32GB |
| BIOS | AMI |
| Watchdog Timer | 256 levels |
| H/W Monitor | Yes |
| Storage Device Interface | N/A |
| Expansion Slots | V1000 Series: 1x PEG(8x)(Gen3), 4x PCI-E(1x)(Gen3), 2x PCI-E(1x) R1000 Series: 1x PEG(4x)(Gen3), 3x PCI-E(1x)(Gen3), 3x PCI-E(1x) |
| Graphics Controller | AMD Radeon™ Vega GPU integrated |
| Video Output | V1000 Series: 3x DDI R1000 Series: 2x DDI 1x LVDS or 1x eDP (By option) |
| Ethernet | Intel® I211AT or I210AT Gigabit LAN |
| I/O Chipset | Fintek F81804U-I |
| Serial Port | 2x UART (Tx/Rx only) |
| USB 2.0 | 8x USB2.0 Port [USB 2.0 Hub x 3 ports, (VL822-Q7)] |
| USB 3.X | 1x USB3.1 port (10G), 3x USB3.1 ports (VL822-Q7) |
| Serial ATA | 2x SATA III via carrier board |
| Audio | AMD Ryzen™ built-in HD audio controller |
| TPM | TPM (2.0) |
| Others | Digital I/O (4in/4-out) |
| Dimensions (L x W) | 125mm x 95mm (4.92" x 3.74") |
| Power Consumption | AMD V1605B w/ 2x 8GB DDR4-2133, +12V: 3.28A AMD R1606G w/ 2x 8GB DDR4-2133, +12V: 3.43A |
| Operating Temperature | 0°C~60°C (32°F~140°F) |
| Storage Temperature | -20°C~80°C (-4°F~176°F) |
| Relative Humidity | 90% (non-condensing @60°C) |
| ET977-1605LV | COM Express (Type-6) CPU Module with AMD Ryzen™ V1605B QC APU (2.0GHz~3.6GHz), DDR4 dual-channel memory, LVDS support |
| ET977-1606LV | COM Express (Type-6) CPU Module with AMD Ryzen™ R1606G DC APU (2.6GHz~3.5GHz), DDR4 dual-channel memory, LVDS support |
| ET977-1505LV | COM Express (Type-6) CPU Module with AMD Ryzen™ R1505G DC APU (2.4GHz~3.5GHz), DDR4 dual-channel memory, LVDS support |
| HSET977-A | Heatsink with Fan for ET977 |
| HSET977-1 | Heat Spreader for ET977 |
| DATASHEETS | ET977 |
| CATALOGS | 2023 Embedded Computing Catalog |
| MANUALS | ET977 COMe Carrier Board Design Guide |
Drivers
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