RISC Platform
RM-N8M Series
Wide-Temperature SMARC™ 2.0 Module with NXP ARM® Quad Cortex-A53/Cortex-M4 i.MX 8M Processor
- NXP Cortex™-A53/Cortex™-M4, i.MX 8M Quad processor
- 3GB LPDDR4, 16GB eMMC on board
- Rich peripheral I/O support
- Validated with Yocto v2.5 and Android 9
- Long life time supply with NxP solution
- Compliant with SMARC™ 2.0
The RM-N8M Series SMARC 2.0 Computer-on-Modules uses 64-bit NXP i.MX8M application processors with ARM technologies for industrial and transportation computing solutions. The RM-N8M Series scalable platforms power various embedded systems with flexible and expandable features for smart factory, imaging, machine vision, gateway, in-flight entertainment and rolling stock applications including passenger information, entertainment and communications systems.
The RM-N8M takes advantage of the performance-scalable multicore platforms to enable highly integrated control systems with advanced graphics, imaging and computational capabilities. It targets lower power and small form factor systems, and measures only 82mm by 50mm. The unit features high flexibility in terms of platform design and customization for end-user applications, while reducing development time and accelerating time to market. Equipped with 3GB soldered LPDDR4 and up to 64GB eMMC Flash memory, it has an extensive set of I/O support with 1x GbE, 2x USB 3.0/2.0, 2x MIPI CSI-2 video inputs, 2x PCI-E (x1) Gen2, 2x SPI/eSPI, 4x UART, 4x I2C, 2x I2S, and 12x GPIO. Display connections are provided by a 1080p MIPI Display Serial Interface (DSI) and HDMI V2.0a with up to 4K resolution.
The ARM Cortex-A53 based RM-N8M modules ship with 15-year longevity support and have been pre-qualified with Yocto v2.5 and Android 9 operating systems. The commercial grade variant supports dual-/quad-core 1.5GHz processors and 0°C to +70°C operating temperature range while industrial grade counterparts run with dual-/quad-core 1.3GHz CPUs and at -25°C to +80°C extended temperature. Also available is the RP-103-SMC, a 3.5-inch disk-size evaluation carrier board providing a broad range of interface and a 12V~24VDC input.
Form Factor | SMARC™ 2.0 |
Processor | NXP i.MX 8M Quad Cortex™-A53/ Cortex™-M4 processor |
System Memory | 3GB LPDDR4 on board |
Flash Memory | 16GB eMMC on board |
Display | 1x MIPI-DSI 4-lane up to 1920 x 1080 at 60Hz 1xHDMI V2.0a, up to 4K |
Video Codec | • 4Kp60 HEVC/H.265 main, and main 10 decoder • 4Kp60 VP9 decoder • 4Kp30 AVC/H.264 decoder • 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder |
Graphics | • GC7000Lite • OpenGL ES 1.1, 2.0, 3.0, 3.1, Open CL 1.2, and Vulkan |
Audio Interface | 2x I²S, 1x SPDIF |
LAN | 1x GbE LAN |
USB | 2x USB3.0/USB2.0 with OTG interface |
Image Capture Interface | 2x MIPI-CSI2 4-lane each |
Serial Interface | 4x UART, 2x SPI |
Media Interface | 2x High-speed MMC/SDIO (MMC 8-bit, SDIO 4-bit) |
PCI-E | 2x PCI-E (x1) Gen2 |
SATA | N/A |
GPIO | 12x GPIO |
I²C | 4x I²C |
Others | Wireless WCN3980 (optional) |
CAN Bus | N/A |
Dimensions | 82mm x 50mm (3.2" x 2") |
Environment | Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins |
Operating Temperature | -25°C ~ 80°C (-13°F ~ 176°F) |
OS Support | Yocto 2.5 Android 9 Other OS (by request) |
Certification | CE/ FCC Class B |
RM-N8M-Q316I | NXP Cortex™-A53/Cortex™-M4, i.MX 8M Quad 1.3GHz processor , 3GB LPDDR4, 16GB TLC eMMC |
DATASHEETS | RM-N8M Series |
CATALOGS | 2023 RISC Based Embedded Solutions |
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