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RISC Platform
RM-QCS610
Wide-Temperature SMARC™ 2.1 Module with Qualcomm QCS610 Processor
- Qualcomm QCS610 SoC
- Up to 4GB LPDDR4, 32GB eMMC
- Qualcomm Adreno 612 GPU 3D graphics accelerator with 64-bit addressing 845 MHz
- 4K video capture and playback at 30fps
- 3.15 TOPS @Caffe
- Validated with Open Linux Embedded 5.4 and Android 12 (2023/2, CS)
- Long life time supply with Qualcomm solution
- Compliant with SMARC™ 2.1
The RM-QCS610 is a SMARC 2.1 compliant module powered by an Octa-core Qualcomm QCS610 SoC and designed for the creation of devices with edge artificial intelligence (AI) and machine learning capabilities such as vision-enhanced drones, advanced intelligent conferencing cameras, and smart robots.
The low power RM-QCS610 offers high performance for devices with edge AI capabilities. It provides flexible I/O interfaces and brings powerful visual edge computing to accelerate AI across devices with sensors or cameras to collect and process information, make decisions, and perform tasks in the same location in applications including traffic data collection and analysis, computer vision in manufacturing, and automated security validation.
The RM-QCS610 features a Qualcomm Adreno 612 GPU 3D graphics accelerator with 4K video capture and 30fps playback support, up to 4GB LPDDR4, 32GB eMMC and dual smart camera operation. Built to withstand harsh environments, it supports a wide-range operating range of from -30°C to +80°C. Aside from offering reliability and longevity in supply, the module has passed OS validation procedure with Open Linux Embedded 5.414.04 and Android 12 (2023/2, CS). The RP-105 carrier board is available for Micro SD, Mini PCI-E, TTL, HDMI, MIPI-DSI, and MIPI-CSI camera expansion.
| Form Factor | SMARC™ 2.1 |
| Processor | QCS610 Kryo Gold: Dual high-performance cores 2.2 GHz Kryo Silver: Hexa low-power cores 1.8 GHz |
| System Memory | On board - 4GB LPDDR4/ 32GB eMMC |
| Flash Memory | 32GB eMMC |
| Display | 1x HDMI up to 1920 x 1080 at 60 Hz 1x MIPI DSI |
| Video Codec | 4K30 8-bit H.264/HEVC/VP8/VP9 Multi-format codec up to 4K30 video encode Multi-stream codec (4K30) (HEVC) + 720p30 (YUV) + 480p30 (VA-YUV) Dual 14-bit image signal processing (ISP) + Lite ISP: 24 MP (2x IFE + 1x IFE Lite, 16 + 16 + 2 MP), 4K30, MCTF, SHDR, C-PHY, DPHY 4K30 8-bit H.264/HEVC/VP8 |
| Graphics | Adreno 612; 845 MHz, 3D graphics accelerator with 64-bit addressing |
| Audio Interface | 1x I2S |
| LAN | 1x GbE Lan |
| USB | 3x USB 2.0 ( Type-A) 1x USB 3.0 (Gen-1 with OTG support) |
| Image Capture Interface | 1x MIPI CSI (2 lane) + 1x MIPI CSI (2 or 4 lane) |
| Serial Interface | 1x UART 2Wire, 2x UART 4Wire, 2x SPI |
| Media Interface | N/A |
| PCI-E | N/A |
| SATA | N/A |
| GPIO | 12x GPIO |
| I²C | 4x I²C |
| Others | wireless WCN3980 (optional) |
| CAN Bus | N/A |
| Dimensions | 82mm x 50mm (3.2” x 2”) |
| Environment | Humidity: 0 % to 90 % RH at 60° C (non-condensing) Shock: Non-Operating: 1G, 15 mins (x-, y-, z-axis) Vibration: Non-operating: 3 Hz to 500 Hz, 15 mins |
| Operating Temperature | -30°C ~ +80°C |
| OS Support | Linux open embedded / Other OS (by request) |
| Certification | CE/ FCC Class-A |
| RM-QCS610L | Industrial grade SMARC™2.1 CPU module, Qualcomm QCS610 SoC, 4GB LPDDR4, 32GB eMMC |
| RM-HSK-Q | Heat sink for IBASE RM-QCS610 series module |
| DATASHEETS | RM-QCS610 |
| CATALOGS | 2023 RISC Based Embedded Solutions |
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