The ET839 ETX module supports industrial wide temperature (-20°C ~70°C) and low heat dissipation efficiency, making it ideal for use in fanless applications in harsh environments. The platform is powered by a 1.91GHz quad-core Intel® Atom® Processor E3845 SoC that features scalable performance that allows simple replacement or upgrade of current Bay Trail-I ETX solutions without changing the baseboard, regardless of the chassis and thermal designs.
The ET839 ETX module also gives customers with flexibility to design different carrier boards with different I/O interface, connectors and functionality specific to their needs and reduce time-to-market.
The new ET839 (95 x 114mm) supports up to 8GB of DDR3L SO-DIMM system memory. Integrated graphics enable dual independent displays via 24-bit dual channel LVDS and CRT graphics outputs with resolutions up to 1600 x 1200 and 2048 x 1536 respectively. Other interfaces and expansion provided include 4x USB, SATA II, 2x IDE, 2x COM, audio, LAN, LPT, PS/2 keyboard/mouse, as well as PCI and ISA bus.
CPU | Intel® Atom® Processor E3845 SoC, 1.91GHz |
PCH | Integrated in Intel® Atom® SoC |
Memory | 1x DDR3L SO-DIMM, Max. 8GB |
BIOS | AMI |
Watchdog Timer | 256 levels |
H/W Monitor | Yes |
Storage Device Interface | N/A |
Expansion Slots | 4x ETX connectors for PCI bus, USB, audio, CRT, LVDS, LAN, COM ports, LPT, IDE, PS/2 keyboard/mouse and ISA bus |
Graphics Controller | Intel® Atom® SoC integrated Gen. 7 4Eus graphics |
Video Output | Supports CRT, 24-bit dual-channel LVDS & 1x DDI port |
Ethernet | Realtek 8106E 10/100Mbps LAN |
I/O Chipset | Nuvoton NCT6102D 1x keyboard, 1x mouse, 1x printer |
Serial Port | 2x RS232 |
USB 2.0 | 4x USB 2.0 via Carrier Board |
USB 3.X | N/A |
Serial ATA | 1x SATA 2.0 port on board (3.0Gb/sec) |
Audio | Intel® Atom® SoC built-in HD Audio w/ Realtek ALC888S codec |
TPM | N/A |
Others | Fintek F85226 ( LPC to ISA) |
Dimensions (L x W) | 95mm x 114mm (3.74" x 4.49") |
Power Consumption | Intel® Atom® E3845 1.91GHz w/ 2x 4GB DDR3L-1600 +5V : 1.92A |
Operating Temperature | -20°C~70°C (-68°F~158°F) |
Storage Temperature | -20°C~80°C (-68°F~176°F) |
Relative Humidity | 10%~90% (non-condensing) |
ET839D1S-I45 | ETX (3.0) CPU Module w/ Intel® Atom® processor E3845 SoC, CRT, LVDS and 10/100 LAN, heat spreader included *(S) means with Realtek ALC888S codec |
IP412 | ETX(3.0) carrier board |
HSET838-BGA-1 | Heat spreader for ET839 |
产品数据表 | ET839 |
产品型录 | 2023 Embedded Computing Catalog |
使用手册 | ET839 |
驱动程序
Model | Chipset | Video | Audio | Network | Others |
ET839 |
Intel Chipset Driver Windows 7 & 8 |
Intel HD Graphics Driver Windows 7 (32 bit) |
Realtek High Definition Audio Driver Windows 7 & 8 |
Realtek RTL8106E Windows 7 |
Intel USB 3.0 Driver Windows 7Intel TXE Driver Windows 7 & 8 |
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